发明名称 DRILLING OF PRINTED CIRCUIT BOARD AND DEVICE THEREFOR
摘要 <p>PURPOSE:To obtain a drilling device which efficiently drills a hole having high reliability by drilling a copper foil and a resin layer immediately before an inner layer copper foil, removing the hole by a twist drill and removing the residual resin layer by irradiating the laser beam and forming a blind hole which reaches the inner layer copper foil. CONSTITUTION:A laser working head 108 is fixed on a column 104, keeping a prescribed interval from a twist drill working head 105. The drilling position of a printed circuit board 110 is positioned under a twist drill 6 by shifting an X-table 102 and a Y-table 103, and a copper foil 1, resin layer 4, glass cloth 3 and 3' on the surface of the printed circuit board 110 are removed, leaving the height (h) from an inner layer copper foil 2, by lowering the twist drill 6, and a window hole 5' is formed. Then, the window hole 5' is positioned directly under the laser working head 108 by shifting the X-table 102 and Y-table 103, and the residual resin layer 4' of the printed circuit board 110 is cut to the surface of an inner layer copper foil from the height (h) by irradiating the laser beam 7 having the nearly equal diameter to the window hole at a hole inlet part.</p>
申请公布号 JPH0435818(A) 申请公布日期 1992.02.06
申请号 JP19900141420 申请日期 1990.06.01
申请人 HITACHI SEIKO LTD 发明人 ARAI KUNIO;KANETANI YASUHIKO
分类号 B23B41/00;B23K26/38;B23P15/00;B23P23/00;B23P23/04;B26F1/16;H05K1/03;H05K3/00;H05K3/46 主分类号 B23B41/00
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