发明名称 PHOTODEGRADABLE HEAT-RESISTANT RESIN COMPOSITION AND MOLDING PREPARED THEREFROM
摘要 PURPOSE:To obtain a composition excellent in photodegradability, heat resistance, transparency and mechanical strengths by mixing a modified polyethylene having carbon monoxide or the like as a comonomer component with polypropylene completely freed from any light stabilizer and antioxidant. CONSTITUTION:A resin composition comprising 90-65wt.% modified polyethylene mainly consisting of ethylene and prepared by copolymerizing ethylene with 0.5-10wt.% carbon monoxide, alone or together with an ethylenically unsaturated compound, and 10-35wt.% polypropylene completely freed from any light stabilizer and antioxidant. When the copolymerization rate of the carbon monoxide is below 0.5wt.%, the rate of photodegradation is markedly low, and when it is above 10wt.%, the rate of photodegradation is so high that the strength is decreased within a short time undesirably. As the ethylenically unsaturated compounds used, vinyl acetate and ethyl acrylate are desirable from the viewpoints of cost, film strengths, heat resistance, gloss and haze.
申请公布号 JPH0436350(A) 申请公布日期 1992.02.06
申请号 JP19900141737 申请日期 1990.06.01
申请人 NIPPON UNICAR CO LTD 发明人 HIROSE KUNIHIRO;INOUE TAKASHI
分类号 C08J5/18;B29C49/06;B29K67/00;B29L22/00;C08L23/08;C08L23/12;C08L73/00 主分类号 C08J5/18
代理机构 代理人
主权项
地址