| 摘要 |
The invention concerns a substrate element for integrated circuits or semiconductor chips, comprising a carrier element in the form of a flexible support foil (2) whose surfaces have contact zones (4), conductor tracks and connection points (6) for the semiconductor chip (7). The substrate element has a stiffener ring (8) whose resistance to flexural stress is greater than that of conventional ISO standard chip cards. Substrate elements (1) of this kind can be manufactured by a fully automatic process as flat strips. In chip cards (36) with substrate elements (1) of this kind, the stiffener ring forms, in conjunction with the flexible support foil (2), a cell rigid in use, thus protecting the semiconductor chip (7) from mechanical damage. |
