| 摘要 |
PURPOSE:To prevent a reduction in the characteristics of a printed wiring board, which is caused by a physical shock, such as a thermal shock, an impact or the like, by a method wherein a hardened material, which comes into contact to a pad part on a wiring pattern (A) and consists of a conductive copper paste, is constituted of a hardened material consisting of a conductive paste, which has a specified adhesive strength to a metal copper, and a hardened material, which constitutes a pad part on a wiring pattern and consists of a conductive copper paste, is constituted of a hardened material, which consists of a conductive paste having a specified adhesive strength to solder. CONSTITUTION:As a hardened material constituting a wiring pattern (B) 4 and a connection part 7, a hardened material consisting of a conductive copper paste is used and a hardened material consisting of a conductive paste, which has an adhesive strength of 0.5kg/mm<2> or stronger to a metal copper, is used for a hardened material, which comes into contact to a pad part 6 on a wiring pattern (A) 2 and consists of a conductive copper paste. Moreover, a hardened material, which consists of a conductive paste having an adhesive strength of 0.8kg/mm<2> or stronger to solder, is used for a hardened material, which constitutes a pad part 5 on the pattern (B) 4 and consists of a conductive copper paste. |
