| 摘要 |
PURPOSE:To obtain a multilayer curved printed board where delamination, crack and spilling back due to aging are suppressed, by differentiating the expansion coefficient of printer wiring network between the opposite sides of a both side printed board by the use of upper and lower molds having temperature difference thereby contracting toward the printed wiring network side heated through the higher temperature mold and molding the both side board intentionally into a curved state. CONSTITUTION:Both side boards 1, 2 are thermally pressed through upper and lower molds 60A, 60B having different temperature. An upper face side copper coil 4 contacting with a high temperature upper mold 60A contracts continuously irrespective of the resistance of a prepreg 30. Both side boards 11, 12 molded into curved face and inserted with a layer insulation prepreg 5 are then thermally pressed 60 and a four layer printed wiring board 13 is then thermally pressed into a curved face thus obtaining a desired four layer curved printed wiring board. |
