发明名称 Micropin array and production method thereof.
摘要 The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array. <IMAGE>
申请公布号 EP0469798(A2) 申请公布日期 1992.02.05
申请号 EP19910306834 申请日期 1991.07.26
申请人 NEC CORPORATION 发明人 INASAKA, JUN
分类号 H01L23/50;H01R12/50;H01R13/24;H01R24/00;H01R43/00 主分类号 H01L23/50
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