| 发明名称 |
Wafer cooling device. |
| 摘要 |
<p>A wafer cooling device, includes a wafer chuck; a heat exchanger having an internal structure for circulation of cooling water therethrough; and a flexible heat pipe for providing heat communication between the wafer chuck and the heat exchanger. <IMAGE></p> |
| 申请公布号 |
EP0469744(A1) |
申请公布日期 |
1992.02.05 |
| 申请号 |
EP19910306453 |
申请日期 |
1991.07.16 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
HARA, SHINICHI;EBINUMA, RYUICHI |
| 分类号 |
G03F7/20;H01L21/00;H01L21/027;H01L21/30;H01L21/683;H01L23/34;H01L23/427 |
主分类号 |
G03F7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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