| 摘要 |
PROBLEM TO BE SOLVED: To provide the sealing method of a liquid refrigerant into a module, in which the liquid refrigerant can be sealed in such a way that air bubbles hardly exist in the high-density module, in which a mounting board with highly dense and highly integrated electronic circuit components is housed. SOLUTION: A module 1, in which electronic components 20 are housed and which is not sealed, is arranged inside a chamber 5 which can be sealed up airtightly. A pressure inside the chamber 5 is set at a refrigerant filling pressure between a vacuum pressure and atmospheric pressure. A liquid refrigerant C is filled into the module 1. After the liquid refrigerant C is filled, the pressure inside the chamber 5 is pressurized to a sealing pressure between the refrigent filling pressure and atmospheric pressure. The module 1 is sealed up airtightly. The liquid refrigerant C is sealed into the module 1. The pressure inside the chamber 5 is set at atmospheric pressure. |
