发明名称 |
CIRCUIT DEVICE AND MANUFACTURE THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device immune to interference and easy to handle which has a printed board, and an image sensor disposed on the printed board wherein connection contacts of the image sensor are conductively connected to contact elements. SOLUTION: A carrier plate 6 has connection contacts, connection contacts 3 of an image sensor 1 are faced at and conductively connected by flip chip bonding to the connection contacts of the carrier plate 6. The carrier plate 6 has openings 6a aligned with a photosensitive surface 2 of the image sensor 1 at regions on this surface 2, forms conductive connections 7 on a printed board 8 and is fixed between the connection contacts of the plate 6 and the connection contacts of the printed board 8. |
申请公布号 |
JP2000357787(A) |
申请公布日期 |
2000.12.26 |
申请号 |
JP20000113866 |
申请日期 |
2000.04.14 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
LOEWE ANDREAS;HOFIUS ARMIN;HEINER ANDREAS;STUMBER TOBIAS |
分类号 |
H01L23/28;H01L21/60;H01L23/12;H01L27/14;H01L31/00;H01L31/02;H01L31/0203;H04N5/225;H04N5/335;H05K1/02;H05K1/18 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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