| 摘要 |
PURPOSE: To collectively bond all chip parts at the same time with a support prepared, assigning a chip part with an electrode pad up, forming a layer of anisotropic conductive bond, bonding all chip parts to a printed circuit collectively, and separating the support from the chip part. CONSTITUTION: A bonder head 100 falls to make a circuit board 30 pressurize chip parts 22 and 24, so that electrode pads 22a and 24a are depressed in a layer 36 of anisotropic conductive bond, resulting in the deformation of a printed circuit 34 and a flexible base material 32. In addition, the layer 36 of bond cures under heat. Thereby, the chip parts 22 and 24 are electrically and mechanically bonded to the printed circuit 34 of the circuit board 30, in short, bonding is completed. Thus, attaching of the chip parts 22 and 24 to the circuit board 30, or mounting is completed, and mounting is finished, when a bonding die 12 is separated from the chip parts 22 and 24 attached to the circuit board 30. |
