METHOD OF SOLDERING OF COMPONENTS ON CIRCUIT BOARDS

摘要

The component to be soldered on is placed on the circuit board whereupon the clip electrodes of the soldering device are lowered and the connecting legs of the component are pressed with a force (F2) against the circuit board. After heating (T) the clip electrodes in order to melt the solder, a further adjustment (sz+) of the clip electrodes takes place to press the connecting legs into the melted solder. Subsequently, a solder layer is formed between the connecting legs and the circuit board by reducing the force (F2) exerted on the clip electrodes and/or by the clip electrodes being set back (sz-) by a defined amount. ……