FORMING METHOD FOR MULTILAYER WIRING OF SEMICONDUCTOR DEVICE,申请号JP19900142859-传众专利搜索

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发明名称	FORMING METHOD FOR MULTILAYER WIRING OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0435047(A)	申请公布日期	1992.02.05
申请号	JP19900142859	申请日期	1990.05.31
申请人	KAWASAKI STEEL CORP	发明人	SATO NOBUYOSHI
分类号	H01L21/768	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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