发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To reduce the manufacturing cost of a device and improve productivity without restrictions on circuit design and chip layout by connecting a first electrode to external signal input lead to operate a circuit while, on the other hand, connecting a second electrode to a power source electrode when the circuit is not to be operated. CONSTITUTION:When an inner circuit 102 is to be operated, an input electrode 104 for external signals is connected with an input lead 109 for external signals through bonding wire while an electrode 105 for applying a fixed potential. When the inner circuit is not operated, on the other hand, the input electrode 104 is maintained open while a power source lead 108 is bonded to the electrode 105 through a power source electrode 106. As a result, the input electrode 104 is maintained at the source potential, i.e., not floating, and thus the inner circuit 102 is prevented from malfunctioning.
申请公布号 JPH0435046(A) 申请公布日期 1992.02.05
申请号 JP19900141883 申请日期 1990.05.31
申请人 TOSHIBA CORP;TOUSHIBA MAIKURO EREKUTORONIKUSU KK 发明人 OSHIMA SHIGEO;YUKANAMI KATSUJI
分类号 H01L21/82;H01L23/485;H01L23/528 主分类号 H01L21/82
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