| 摘要 |
SOLDER SYSTEM AND METHOD OF USING SAME A solder system is adapted for use in soldering the terminals of a plurality of circuit boards, to corresponding leads of a plurality of cables. The solder system includes a holding mixture for supporting adjustably the circuit boards relative to the corresponding cables. A gripper assembly retains the cable leads in position above the corresponding board terminals. A monitor assembly is utilized to supervise optically the various stages of the soldering process. A heater assembly is mounted adjustably above the holding fixture for reflowing the solder material over the aligned cable leads and board terminals. <18118-01.209> |
