| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which the different structural sections of an electronic circuit can be inspected with as high reliability as possible, without reducing the number of valid regions on a semiconductor substrate. SOLUTION: The method for inspecting structural section includes a step of forming first structural sections in scribe lines by forming first and second structural sections in effective regions in accordance with a prescribed pattern, by using a first mask on which can array constituting section composed of effective region, scribe lines, and the edge sections of the scribe lines is extended over the first region of the semiconductor substrate and a step of forming second structural sections in scribe lines by forming first and second structural sections in effective regions, in accordance with a prescribed pattern by using a second mask on which an array constituting section composed of effective regions, scribe lines, and the edge sections of the scribe lines is extended over the second region of the semiconductor substrate. The first structural sections in the scribe lines of the first region and the second structural section in the scribe lines of the second region are used for the inspections of the first and second structural sections in the effective regions in each case.
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