| 摘要 |
PURPOSE:To obtain the accurate parallelism of laminate structure by arranging a land part of each through hole without contacting the surface of an opposite layer and bringing respective layers into uniform inter-layer surface contact. CONSTITUTION:A couple of fixed substrates 1 and 2 are arranged opposite each other across a specific gap, one fixed electrode is formed on the internal surface of the upper substrate 1, and the other fixed electrode is formed on the internal surface of the lower substrate 2 correspondingly. A conductive plate member 3 is interposed between the substrates 1 and 2 and the peripheral part of the member 3 constitutes a movable electrode. Further, a circuit board 5 is provided, a terminal 6 for external connection is mounted, and layers each constituted by laminating the substrate 2, plate member 3, and substrate 1 in order are mounted on the substrate 5 to constitute the laminate structure. Electric to the terminal 6 are made through the inter-layer surface contact between metal patterns which are made conductive through holes. Then the land parts of the respective through holes are arranged without contacting the surfaces of the opposite layers and the parallelism between the layers can be held with extremely high accuracy. |
