发明名称 CHEMICAL MACHINERY POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a chemical machinery polishing device for restraining corrosion caused to a welding material for fixing diamond grains by slurry and lengthening the working service life of an adjusting brush. SOLUTION: This chemical machinery polishing device is provided with at least an adjusting brush body and plural adhesive pads. The plural diamond grains are adhered to the respective adhesive pads. The adhesive pads are arranged on an under surface of the adjusting brush and the peripheral edge of a body of the adjusting brush. Plural holes penetaring through upper and under surfaces of the adjusting brush are formed between the adhesive pads in the body of the adjusting brush. When processing a polishing pad by using the adjusting brush, ion removed water flows to the periphery of the diamond grains via these holes, and the acid or basic slurry is diluted and washed away.
申请公布号 JP2001347450(A) 申请公布日期 2001.12.18
申请号 JP20000172385 申请日期 2000.06.08
申请人 PROMOS TECHNOLOGIES INC;MOSEL VITELIC INC;INFINEON TECHNOLOGIES INC 发明人 JEN-CHIE TOUN;MIN-CHON YAN;RIN RUN FU;WANG JIUN-FANG
分类号 B24B53/017;B24B53/02;B24B53/12;H01L21/304 主分类号 B24B53/017
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