| 摘要 |
<p>PURPOSE:To protect bump electrodes and conductive particles from application of excessive forces and avoid breakdown of them and breakdown of lower layer of the electrodes by a method wherein spacers which are not connected to the electrodes are provided between the surface of a chip which has the electrodes and the surface of a circuit board which has the electrodes and the corresponding electrodes of the chip and the board are connected to each other. CONSTITUTION:A plurality of electrodes 14a are provided on the necessary parts of a chip 1. Also, a plurality of thin film electrodes 24a are formed on the necessary parts of a circuit board 2. The thin film electrodes 24a are so positioned as to correspond to the electrodes 14a of the chip 1 when the chip 1 is mounted on the circuit board 2. Spacers 23a are formed on an insulating layer 22 formed on the surface of an insulating board 21 so as to face the circumferential part of the chip 1. The insulating layer 22 covers the surface of the insulating board 21 except the parts of the thin film electrodes 24a to protect thin film wirings. The spacers 23a are continuously or intermittently formed into required shapes by, for instance, the screen printing of glass paste on the surface of the insulating layer 22. The height of the spacer 23a is so adjusted as to be smaller than the diameter of elastic conductive particles 41 bonded to the electrodes 14a by 1-5mum. Further, the rigidity of the spacer 23a is selected to be relatively high in order to protect the bumps and the elastic conductive particles from application of excessive forces.</p> |
