| 摘要 |
PURPOSE:To obtain a broad working width and a high adhesive property to a silicon oxide film by polymerizing monomers having specific groups thereby forming a resin compsn. consisting of a polybenzoxazole precursor. CONSTITUTION:The positive type photosensitive resin compsn. consisting of the polybenzoxazole precursor E having 2 to 500 degree of polymn. is obtd. by polymerizing the monomers A to D having the group expressed by formulas I to IV respectively at 2 to 50mol%, 2 to 50mol%, 0 to 48mol%, 0 to 48mol%, (A+C)/(B+D) = 0.9 to 1.1. In the formulas I to IV, W denotes a bivalent arom. group; X denotes a quadrivalent arom. group; Y denotes a bivalent arom. group; Z denotes a bivalent arom. group, aliphat. group. The broad working width in a developing state is obtd. in this way and the high adhesive property to the silicon oxide film is obtd. |
