| 摘要 |
<p>PURPOSE:To improve packaging density through suppression of chip erection phenomenon by forming a pair of end face electrode layers on substrate end faces so as to be connected to a pair of top electrode layers and a pair of rear electrode layers formed on the front and the rear of an insulating substrate, respectively, and by forming a resistance layer connected to the top electrode on the front of the substrate to provide an unsolderable protection layer by covering the end face electrode layers. CONSTITUTION:A pair of top electrode layers 2 and a pair of rear electrode layers 6 made of silver-based thick film electrode are formed on the front and the rear of an insulating 96 alumina substrate 1, respectively. Next, a resistance layer 4 made of a ruthenium-based thick film resistor is so formed as to overlap the top electrode layers 2, and a glass layer 5 which covers this layer is formed. Then, the substrate 1 is divided into strips, and end face electrode layers 3 are formed on the side faces of each strip so as to overlap the top electrode layers 2 and the rear electrode layers 6, And a glass-made protection layer 9 is formed so as to cover these layers. This structure prevents suction force due to molten solder generated in the end faces to provide the effect of suppress chip erection phenomenon.</p> |
