| 摘要 |
PURPOSE:To deal with variations of the shapes of object IC packages, simplify an exchange part, and reduce the cost constructing a conveyance passage into a structure, halved vertically. CONSTITUTION:For a conveyance passage, an IC conveyance package are divided into three parts of side beams 1, 3 and a main beam 2, and for an IC conveyance method the side beams are operated simultaneously vertically and longitudinally to convey ICs. Further, for the conveyance passage the beams 1, 2, and 3 are halved vertically. Lower hatched portions are fixed to a facility and upper ones are exchangeable, with the lower and upper portions being screwed each other. Further, for the size of an IC 4 being larger or smaller, the lower portions are kept unchanged and only the upper portions are exchanged, matched to the size of the IC. The beams 1, 2, and 3 to be exchanged are each provided, matched to the size of the IC. |
