| 摘要 |
<p>PURPOSE:To simplify a mounting process and to enhance a mounting density by a method wherein an IC component is bonded directly, in a flip-chip manner, to a via-hole filled metal layer on the surface of a multilayer board. CONSTITUTION:Solder bumps 3 of an IC component 1 which is placed facedown are aligned with end parts 6' of via-hole filled metals 6 exposed on the surface of via holes 5 guided from internal wiring 7 of a multilayer board 4; and the via-hole filled metal end parts 6' and the solder bumps 3 of the IC component, which correspond to each other, are heated and welded. The contraction at a baking operation of the multilayer board is generally larger than the contraction of a conductor metal which is filled into the via holes; the end parts of the via holes are swollen on the surface of the board at the baked multilayer board; and a flip-chip bonding operation can easily be executed without forming solder bumps especially.</p> |
