Method of filling conductive material into through holes of printed wiring boards

摘要

The invention provides a method of filling the through holes 5 of a printed wiring board 1 with conductive filler material 8 by initially feeding compressed air to the conductive filler material across a mask 13 in the direction of the through holes so that pressurised conductive filler material can be filled into the through holes 5 from a conductive-material extruding nozzle unit 14.