发明名称 Splittable printed wiring board
摘要 A method of manufacturing a p.c.b. comprises providing a thickness adjusting film 9 on a substrate 4 splittable by means of slit 5 and perforations 6; and form at on of the slit and perforations by means of a pressing and punching process. Film 9 offsets gaps between the pressing molds (7, 8) (Fig. 4) due to circuit 2 for example, and prevents the formation of cracks during pressing. <IMAGE>
申请公布号 GB2246477(A) 申请公布日期 1992.01.29
申请号 GB19910013016 申请日期 1991.06.17
申请人 * NIPPON CMK CORP. 发明人 YASUNORI * MATSUSHIMA
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
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