发明名称 DOUBLE FACE POLISHING DEVICE
摘要 PURPOSE:To enable a double face polishing similar to a thick work even in case of a thin work, by projecting the key of a connector downward so as to be able to interlock with the key groove located at a main shaft head. CONSTITUTION:A work 11 stored in a carrier 12 is subjected to lapping with upper and lower surface plates 1, 2 being rotated in the opposite direction respectively and with the carrier 12 interposed therein being rotated and revolved. In this case, the rotation of the upper surface plate 2 driven from the head 7 of a main shaft existed at the rotation center is given via a connector 5 from the head 7 of the main shaft. The work 11 is made workable even in the case of its thickness dimension being thick or thin, by providing a projection 5'' which is engaged with the head 7 of the main shaft on this connector 5.
申请公布号 JPH0425372(A) 申请公布日期 1992.01.29
申请号 JP19900127744 申请日期 1990.05.17
申请人 SEIKO ELECTRONIC COMPONENTS LTD 发明人 SUZUKI TSUYOSHI
分类号 B24B37/07;B24B37/08 主分类号 B24B37/07
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