| 摘要 |
PROBLEM TO BE SOLVED: To improve yield of products by adequately dealing with manufacturing errors of an electronic component formed in a smaller size in prospect of elongation by a thermo compression bonding. SOLUTION: In the thermo compression bonding method and apparatus, before thermo-compression bonding an outer lead 54 formed on a film carrier 52 where the quantity of elongation thereof changes in response to a thermo compression bonding condition to an electrode 58 formed on a transparent plate 56, the positions of a first mark MA and a second mark MB formed on the film carrier 52 are measured. Then, the distance between these marks is obtained, and the thermo-compression bonding condition is determined on the basis of this obtained distance, and the thermo-compression bonding is performed under the determined condition.
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