发明名称 SUBSTRATE FEED APPARATUS
摘要 PURPOSE:To make effective use of a space which is not used in a substrate magazine by a method wherein a plurality of substrates loaded and housed in a plurality of rows inside the substrate magazine are taken out simultaneously, they are delivered to a substrate acceptance means and they are simultaneously fed to a downstream-side apparatus from the substrate acceptance means. CONSTITUTION:When upper and lower sheets 16, 17 are moved upward by using a first up-and- down movement mechanism, a stage 13 is moved upward via mounting plates 14, 15, and a substrate 2 at the uppermost stage is on standby in a prescribed position. The upward movement of the up-and-down movement mechanism is stopped. Then, a suction pad 18 is moved downward by using a second up-and-down movement mechanism, and four substrates 2 at the lowermost stage are sucked simultaneously. After this suction operation is completed, the suction pad 18 is moved upward in a state that the suction pad has sucked the substrates 2; and the substrates 2 are positioned in a prescribed position. On pair of acceptance parts 19 in an open state are actuated in a direction to be closed; after that, the suction pad 18 is moved downward; and the substrates 2 are coupled and stopped to a coupling part 19A of the acceptance part 19. After this coupling operation is completed, the suction pad 18 releases the suction of the substrates 2, is moved upward and is moved away from the substrates 2. The four substrates 2 placed on the acceptance part 19 is fed to a conveyance chute 20 by using a pusher 21.
申请公布号 JPH0426198(A) 申请公布日期 1992.01.29
申请号 JP19900131665 申请日期 1990.05.22
申请人 SANYO ELECTRIC CO LTD 发明人 ICHIKAWA YOSHIO
分类号 H05K13/02 主分类号 H05K13/02
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