Cooling semiconductor devices

摘要

A semiconductor device comprises a semiconductor chip 21 including a substrate and a plurality of heat emissive elements formed on a surface portion thereof. The semiconductor chip 21 has a thermally conductive layer 23 formed on the chip so as to be in the proximity of the elements in order to conduct and dissipate heat produced by the elements. A thermally conductive plate 22 is provided adjacent the chip 21 and a heat discharging fin 24 is attached to the opposite side of the plate 22 from the chip 21. A second thermally conductive plate 26 and a cooling fin 27 are also provided. In a modification the device is mounted in a duct supplied with cooling fluid.