| 摘要 |
PURPOSE: To provide a technology capable of preventing the generation of burrs on a mold by arranging an O-ring bead on a lead frame and capable of delimiting the external size of the molded plastic. CONSTITUTION: A plate 11 on the same surface as the upper surface of a semiconductor device package 10 is aligned with a bottom plate 14 and held by a plastic ring 12 molded on a prescribed position. A cavity type package is formed by an elastic plastic bead 15 formed on a read frame with which a lead 13 is assembled. Copper is suitable as a lead frame substance, but other proper metals can also be used. |
