发明名称 BONDING TOOL
摘要 PURPOSE:To contrive the improvement of the heat resistance, hardness and abrasion resistance of a bonding tool by a method wherein a material where a polycrystalline diamond layer separated by a vapor-phase synthesis method is applied on a base body consisting of a sintered body containing Si, Si3N4, SiC or the like as its main component or these compound material is used as the tip part of the tool. CONSTITUTION:A material where a polycrystalline diamond layer 1 separated by a vapor-phase synthesis method is applied on a base body 2 consisting of a sintered body containing Si or Si3N4 as its main component, a sintered body containing SiC as its main component or a sintered body containing AlN as its main component and/or these compound material is used as a tip part of a tool. This tip part is bonded to a shank 4 made of a metal, whose one part at least has a linear expansion coefficient of 7.5X10<-6>/ deg.C or lower between room temperatures and 600 deg.C, and/or an alloy. Thereby, a base body 1, which has a thermal expansion coefficient near that of the diamond layer, has a good adhesion to the applied layer 1 and has a high heat resistance, can be obtained.
申请公布号 JPH0425138(A) 申请公布日期 1992.01.28
申请号 JP19900129924 申请日期 1990.05.18
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NAKAMURA TSUTOMU;TANAKA KATSUYUKI;NAKAI TETSUO
分类号 H01L21/52;C04B37/02;H01L21/60 主分类号 H01L21/52
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