发明名称 OPTICAL SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PURPOSE:To enable chip carriers various in types to be arranged precisely at the same position always by a method wherein either the step face of an upper stage or the pressing face of a carrier fixing plate is formed into an arc-shaped recess. CONSTITUTION:A stage is provided with a lower stage 12 on which a chip carrier 3, an upper stage 11 which is different from the lower stage 12 in level and bears against the side face of the chip carrier 3, and a chip carrier fixing plate 16 which is provided with a side face that presses the side face of the chip carrier 3 as opposed to the side face of the upper stage 11 and able to move along the face of the lower stage 12 or to be optionally fixed. Either the step face of the upper stage 11 or the pressing face of the carrier fixing plate 16 is formed into an arc-shaped recess 13. For instance, provided that the step face is formed into the arc-shaped recess 13 and the pressing face of the fixing plate 16 is formed flat, the fixing plate 16 makes a force act on the chip carrier 13 to enable it to move toward the deepest point of the arc-shaped recess 13. By this setup, many types of chip carriers 3 can be arranged at the same position on a lower stage always.
申请公布号 JPH0425150(A) 申请公布日期 1992.01.28
申请号 JP19900129106 申请日期 1990.05.21
申请人 TOSHIBA CORP;TOSHIBA ELECTRON ENG CORP 发明人 ONO REIJI
分类号 H01L21/68;B23Q3/18;H01L21/687;H01L33/62 主分类号 H01L21/68
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