发明名称 |
GROOVED HEAT PIPE COOLING APPARATUS FOR SEMICONDUCTORS |
摘要 |
A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted. |
申请公布号 |
CA1295054(C) |
申请公布日期 |
1992.01.28 |
申请号 |
CA19880586083 |
申请日期 |
1988.12.16 |
申请人 |
FURUKAWA ELECTRIC CO., LTD., (THE) |
发明人 |
MURASE, TAKASHI;TANAKA, SUEMI |
分类号 |
H01L23/427 |
主分类号 |
H01L23/427 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|