| 摘要 |
PURPOSE:To contrive the improvement in a high-frequency characteristic and a resin-filling property among inner layer circuits by arranging a heat-hardening polyphenylene oxide resin film on an upper side and/or a lower side of a necessary number of inner layer materials and further uniting a lamination body in which an outer layer material is laid on the outermost layer into one body. CONSTITUTION:In this multilayer interconnection substrate, a heat-hardening polyphenylene oxide resin film is arranged on an upper side and/or a lower side of a necessary number of inner layer materials, and further a lamination body in which an outer layer material is laid on the outermost layer is united into one body, so that the film improves a resin-filling property among inner- layer circuits and the heat-hardening polyphenylene oxide resin can improve a high-frequency characteristic. As the heat-hardening polyphenylene oxide resin film, a heat-hardening polyphenylene oxide resin composed of a crosslinked polymer such as 1.2-polybutadiene and a polymerization initiator such as benzoyl peroxide, which is made into a film of 0.05-0.5mm thickness, is used for a polyphenylene oxide. According to a need, a necessary number of films can be used. |
