| 摘要 |
<p>PURPOSE:To enable a UV lamp smaller than a wafer in diameter to irradiate all the surface of the wafer with ultraviolet rays by a method wherein the wafer or ultraviolet rays are rotated as the UV lamp of an ultraviolet irradiation device is provided eccentric to the wafer. CONSTITUTION:An ultraviolet irradiator 14 is provided eccentric to a wafer 1 on which an ultraviolet curing adhesive agent film 2 is pasted, and the wafer 1 or the ultraviolet irradiator 14 is made to rotate. For instance, the length of the lamp 14 is slightly larger than the diameter of the wafer 1, a vertical center line a of rotation of a support table 3 is made to extend passing through the edge of the lamp 14, ultraviolet rays are made to irradiate the wafer 1 covering it from its center to its periphery, and the support table 3 sucking the wafer 1 is made to start rotating at the same time when ultraviolet rays are made to start radiating. By this setup, a large wafer can be uniformly irradiated with UV rays by the use of a small device, and the film 2 can be separated off without inducing cracks or chips in the wafer.</p> |
