| 摘要 |
PURPOSE:To make it possible to obtain a temperature necessary for an acceleration test without needing an external device by a method wherein a heating unit is provided within a chip with a circuit constituted thereon or in proximity to this chip. CONSTITUTION:A heating unit is provided within a chip 1 with a circuit constituted thereon or in close contact to this chip. For example, a resistor 6 which is used as the heating unit, through which arbitrary bonding pads 3a and 3b are connected to each other, is provided within the chip 1 and is put into a state that it can be connected to a variable-voltage external power supply 7. When an acceleration test for the IC chip is conducted, the resistor 6 and the power supply 7 are brought into a state of connection, the voltage of the power supply 7 is properly increased, a current is made to flow through the resistor 6 to generate heat and the temperature of the chip 1 is made to rise. Thereby, the state of a high temperature in the acceleration test can be obtained without utilizing an external device. |
