| 摘要 |
<p>PURPOSE:To reduce the area for fixing electronic components and obtain a small-sized circuit board, by forming a hole for inserting an electronic component which hole reaches an inner layer pattern, forming an electrode pattern on the surface layer, inserting and arranging an electronic component having conducting parts on both ends into the hole, and connecting and fixing the inner layer pattern and the electrode pattern with the conducting parts of the electronic components by using conductive connection material. CONSTITUTION:An electronic component 13 is fixed to a multilayer circuit board 10 in the following manner. Firstly conductive connection material 14 is spread on the inner layer pattern, and an electronic component 13 is inserted with pressure into a hole formed in the multilayer circuit board 10; secondly the board is dipped in solder solution, and an electrode pattern 12 and conducting parts 13a of the electronic component 13 are connected and fixed by using the conductive connection material 14 of solder, thereby fixing the electronic component 13 to the multilayer circuit board 10. In this case, almost the whole electronic component 13 is positioned and contained in the hole 11 of the multilayer circuit board 10, and the occupied area of the electronic component 13 becomes only the conduction part 13a, so that the occupied area is reduced.</p> |
