| 摘要 |
PURPOSE:To realize free design of permitivity, by laminating outer layer material on the surface of an inner layer circuit board via prepreg, and unifying them in a body, which inner layer circuit board is formed by laminating a plurality of prepregs whose permitivities are different. CONSTITUTION:Four glass cloth substratum epoxy resin prepregs and four glass cloth substratum polyphenylene oxide prepregs are stacked; copper foils of 0.035mm in thickness are stacked on both surfaces; a first laminate is molded by heating and pressing this; a circuit is formed by etching the copper foils; thus obtaining an inner layer circuit board, whose permitivity is about 4.1. A glass cloth substratum epoxy resin prepreg is stacked on each of the upper and the lower surfaces of the inner circuit boards; a copper foil of 0.035mm in thickness is stacked on each of the prepreg surfaces; a second laminate is molded by heating and pressing this; thus obtaining a multilayer printed board of 4-layered circuit constitution, whose permitivity is about 4.3. |
