| 摘要 |
PURPOSE:To make it possible to uniformly develop the resist deposited on a semiconductor wafer by a method wherein a cylindrical rectifying cylinder, which is communicated with an air-intaking hole, is provided on the upper part of the circumference of the aperture part of a splash-preventing plate. CONSTITUTION:A cylindrical rectifyer tube 21, which is communicated to an air-suction hole 15, is provided on the upper part of the circumference of the aperture part 14a of a splash-preventing plate 14. Accordingly, when the resist 32 deposited on a substrate 31 is developed, an air stream flowing into an air- suction hole 15 is generated by allowing air to flow from upside to bottom side when an exhaust device 17 is operated. As a result, a developing solution 33, jetted from a spray gun 16 together with high-pressure gas, streams from upside to bottom side, and it is uniformly sprayed on the resist 32, which is deposited on the substrate 31, being carried by the air stream F flowing into the air suction hole 15. As a result, the resist 32 deposited on the substrate 31 can be developed uniformly. |
