| 摘要 |
<p>PURPOSE:To prevent defective wafers from occurring due to scratches induced on the wafers by a belt by a method wherein a transfer table is provided between a load section and an unload section, a wafer is taken out from the load section onto the transfer table and transferred to a processing section through vacuum suction, and a vacuum suction plate is provided to transfer the processed wafer to the unload section. CONSTITUTION:A transfer table 67 is provided between a load section 1 and an unload section 62, a rotary table 63 is disposed above the table 67, and a movable member 71 which can be optionally moved to the load section 1 and a processing section A is provided onto the rotary table 63. A vacuum suction plate 72 which transfers a wafer 3 taken out from the load section 1 to the processing section A and the processed wafer 3 to the unload section 62 is provided to the movable member 71. An up-down frame 73 is provided to the unload section 62, a rotary table 90 is provided onto the up-down frame 73, a movable member 79 which can be optionally moved toward the unload section 62 and a wafer support table 73 is provided thereon, and a vacuum suction device 77 which transfers the processed wafer 3 on the support table 73 to the unload section 62 is provided to the movable table 79. By this setup, an endless belt can be dispensed with, a wafer transfer device can be simplified in mechanism, and defectives can be prevented from occurring due to scratches induced on the wafers by a belt.</p> |
