发明名称 MULTILAYERED LEAD FRAME AND MANUFACTURE THEREOF
摘要 PURPOSE:To dispense with an insulating tape piece and to enable a multilayered lead frame to be lessened in manufacturing man-hours and to improve alignment accuracy by a method wherein layers of the metallic planes are bonded together through an adhesive agent film. CONSTITUTION:A multilayered lead frame is composed of a lead frame 12, a power supply plane 14, and a ground plane 16. The planes 12, 14, and 16 are bonded together into an integral structure interposing an insulating adhesive film 18 of thermosetting resin between them. By this setup, as an insulating tape piece which is employed in a conventional manufacturing method is not used, a forming process of the insulating tape piece and a positioning process in which the insulting tape itself is positioned to the leas frame 12 and the metal planes when they are laminated together can be dispensed with, and a multilayered lead frame high in accuracy can be obtained.
申请公布号 JPH0425163(A) 申请公布日期 1992.01.28
申请号 JP19900130083 申请日期 1990.05.18
申请人 SHINKO ELECTRIC IND CO LTD 发明人 SHIMIZU MITSUHARU;TAKEDA YOSHIKI
分类号 H01L23/50;H01L21/48;H01L23/495 主分类号 H01L23/50
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