| 摘要 |
PURPOSE:To obtain a printed board which permits easy exchange of ICs without damaging a through hole and peeling a metal layer when exchanging ICs by firmly fixing resin possessing elasticity and conductivity with a hole for inserting IC lead at the center in the through hole. CONSTITUTION:In the through hole of a printed board 1, elastic and conductive resin 3 possessing a hole for inserting an IC lead at the center is brought into contact with a metal layer 2 to fill the through hole and the diameter of the hole for inserting the IC lead is smaller than the diameter of the IC lead. The elastic and conductive resin 3 is pressed in the radial direction by inserting the IC lead into the hole for inserting the IC lead. Therefore, the IC lead is supported and conduction is maintained.
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