| 摘要 |
<p>PURPOSE:To obtain an IC complete with spring lead in which the times of charging/removing operations of a solder can be decreased by using a material with spring performance for the contact portion to an island for interconnection of a packaging board of an outer lead of a semiconductor IC and by forming the contact portion into a shape with spring performance. CONSTITUTION:When an IC complete with spring lead is charged in a packaging board, the surface of an outer lead 2 is formed into a shape with spring performance by using a material with spring performance, for which highly conductive plating such as solder plating has been made, and spring performance is given to the connecting portion to an island 3 for interconnection of a packaging board 4. Therefore, maintenance and electric connection of a main semiconductor IC 1 are made simultaneously without adhesion by soldering. As a result, the times of charging/removing operations can be decreased, and elimination of a soldering process and cleaning up of the packaging board are made possible.</p> |
