| 摘要 |
<p>PURPOSE:To completely absorb a radial stress due to mismatching of thermal expansion coefficients of an electronic component and a board and to improve durability against repetitive thermal stress by radially disposing many leads at the center of a component body formed in a rectangular shape as a reference. CONSTITUTION:Many leads 22 radially protrude from the periphery of a component body 21 formed in a rectangular shape with the center of the body 21 as a reference, and the lower bent parts 22a of strip leads 22 are soldered to a board. Since points of an electronic component are concentrically enlarged or contracted at the component center as a center due to mismatching of thermal expansion coefficients of the component and the board, a stress S is radially operated from the center of the body 21, but since the parts 22a of the leads 22 disposed diagonally in the concentric circle are deflected to completely absorb the stress S. Thus, an excess stress is not applied to a solder joint on the board in which the part 22a of the leads 22 are bonded, and the solder joint has a long life against repetitive stress due to a temperature cycle, etc., at the time of use of the board.</p> |
