| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipater for CPU exhibiting significant heat dissipation effect at a low cost without modifying the facility significantly. SOLUTION: The heat dissipater for CPU comprises a film formed of a mixture of alkoxy silane solution, water dispersion of colloidal silica, silicon oxide powder, aluminium oxide powder and kaolin powder, a film formed of aqueous solution of sodium silicate and potassium silicate, silicon oxide powder, aluminium oxide powder and kaolin powder, or a film formed of a mixture of emulsion containing silicon resin, silicon oxide powder, aluminium oxide powder and kaolin powder. Preferably, a film is formed on the outer surface of a fixing cover for arranging a fan motor on the heat sink body comprising fins and/or the outer surface of the fin located on the outermost side of the heat sink. Preferably, film thickness is 10-100μm. COPYRIGHT: (C)2005,JPO&NCIPI |
