| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil with a resin excellent in dielectric characteristics and enabling fine via-processing, and a multilayered printed circuit board. SOLUTION: The metal foil with the resin has a resin layer containing a benzocyclobutene resin and an ultraviolet absorber. Further, the resin layer preferably has a first layer containing the benzocyclobutene resin and a second layer containing the benzocyclobutene resin, and the ultraviolet absorber is added to at least one of the first and second layers. Furthermore, the multilayered printed circuit board is obtained by superposing the metal foil with the resin on one side or both sides of an inside layer circuit board to heat and press the same. COPYRIGHT: (C)2005,JPO&NCIPI |
