| 摘要 |
PURPOSE:To aim at improving reliability of packaging by measuring the dislocation amount of packaging on a board of electronic parts and so on, and by generating feedback processed data after totalization of required measuring results and statistics processing of the converted dislocation amount. CONSTITUTION:At a dislocation amount measuring stage 1, the dislocation amount from the packaged position of an electronic parts on a board is measured by packaging data. Then, at a generating stage 2, the results to be processed among measuring results are totalized, converted, and generated into data. In addition, when the data undergo statistics processing at a statistics processing stage 3, the data has capabilities of feedback of a packaged data, adjustment/selection/evaluation of devices and electronic parts. Finally, the data are actually processed at a processing stage 4. Therefore, reliability of packaging is increased and quality of the packaged board is improved. |
