| 摘要 |
PURPOSE:To enable formation of a via having high reliability by filling a via hole with metallic powder as a conductor and by closing it up by metallic paste thereafter. CONSTITUTION:As a conductor 4 to fill a via hole 3, an organic binder is not used but a copper powder 4a alone is used. After filling of the copper powder 4a, the via hole 3 is closed up by copper paste 4b. The copper paste 4b prevents filled copper powder 4a from scattering and also functions to fill a clearance when it is formed above the via hole 3 during filling of the copper powder 4a. Therefore, it is possible to improve filling density of the conductor 4 to the via hole 3 by filling the copper paste 4a and to improve electrical connection properties of a via 9 to be formed. Reliability of a multilayer ceramic board can be improved in this way. |
