发明名称 MANUFACTURE OF COPPER-CLAD LAMINATED PLATE
摘要 PURPOSE:To improve the adhesive strength between the copper foil and the prepreg of a copper-clad laminated plate and between the prepregs of the plate by a method wherein the prepregs with a surface treatment coating film, which is obtained by mixing a coupling agent with a surface active agent, applied on their surfaces are superposed and the copper foil is laminated on the superposed prepregs to form the copper-clad laminated plate. CONSTITUTION:A surface treating solution 6 obtainable by mixing a coupling agent with a surface active agent is applied and dried on a prepreg vase material G, which is impregnated with a resin and is dried, and a surface treatment coating film A of 0.001 to 0.1wt.% to the weight of a prepreg is applied on the surface of the base material G to form a prepreg 9a. When a copper foil is laminated on a prescribed number of sheets of these superposed prepregs 9a and the laminated material is pressed and heated, a glass epoxy copper-clad laminated plate is formed. As the composition of the surface treating solution 6, it is suitable to set the weight ratio of the surface active agent to the coupling agent in the ratio of 1:0.01% to 1:0.5%.
申请公布号 JPH0423385(A) 申请公布日期 1992.01.27
申请号 JP19900123635 申请日期 1990.05.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 ADACHI KYOKO;FUTAKUCHI MICHIO;YAIZUMI YUTAKA;SUZUKI MORIHIDE
分类号 H05K1/03;B32B15/08;H05K3/38;H05K3/46 主分类号 H05K1/03
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