| 摘要 |
<p>PURPOSE:To acquire a printed wiring board without residue and solder creeping in a via hole part by providing a resist coating only in an electrical through hole in a conductive pattern laminated board of both sides or three layers or more. CONSTITUTION:A resist coating is provided only to an electrical through hole in a conductive pattern laminated board of both sides or three layers or more. That is, a conductive pattern 3 and further a via hole 2 are formed on one side or both sides of an insulating substrate 1 by a known method. A solder resist 4 and further an under-coat resist 5 are provided by lamination printing without coating the via hole 2 making an electrical connection part remaining. Lastly, the via hole 2 is coated, printed and formed by printing ink 6 of a part sign during printing of the part sign. Thereby, it is possible to remove residue such as acid solution or surface activator, etc., which is surface treatment before resist coating printing in a process and to prevent ejection of solder and creeping of flux to a part-mounting surface during soldering.</p> |
