| 摘要 |
PURPOSE:To restrain a resin-molded package from being cracked at a test process such as a temperature cycle test, a thermal shock test or the like and at a soldering and mounting process by a method wherein a cutout part is formed and a die pad is divided by using the cutout part. CONSTITUTION:A semiconductor chip 4 is bonded to a die pad 8 via a thin bonding part composed of a silver paste; cutout parts 9 which are extended to the central direction from its outer circumference are formed in the die pad 8; and the pad 8 is divided into four parts by the parts 9. Molding resins on both the surface side and the rear surface side of the die pad 8 are bonded through the portions situated on the outer side of a chip mounting region 10 out of the parts 9; and it is possible to restrain that the molding resin on the rear surface side of the die pad 8 is contracted thanks to its bonding part. Thereby, it is possible to restrain a package crack caused by a thermal stress at a temperature cycle test, a thermal shock test and the like and a package crack caused by expansion of moisture at a soldering and mounting operation. It is possible to sharply increase the reliability and the yield of a semiconductor integrated circuit device 1.
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